JPH0443423B2 - - Google Patents
Info
- Publication number
- JPH0443423B2 JPH0443423B2 JP59248828A JP24882884A JPH0443423B2 JP H0443423 B2 JPH0443423 B2 JP H0443423B2 JP 59248828 A JP59248828 A JP 59248828A JP 24882884 A JP24882884 A JP 24882884A JP H0443423 B2 JPH0443423 B2 JP H0443423B2
- Authority
- JP
- Japan
- Prior art keywords
- thick film
- layer
- glaze
- dielectric
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 30
- 239000000463 material Substances 0.000 claims description 23
- 239000000758 substrate Substances 0.000 claims description 22
- 238000002844 melting Methods 0.000 claims description 10
- 230000008018 melting Effects 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 8
- 238000000151 deposition Methods 0.000 claims description 7
- 238000007664 blowing Methods 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 239000003989 dielectric material Substances 0.000 claims description 3
- 238000007650 screen-printing Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims 3
- 238000007605 air drying Methods 0.000 claims 2
- 239000010408 film Substances 0.000 description 39
- 229910052751 metal Inorganic materials 0.000 description 15
- 239000002184 metal Substances 0.000 description 15
- 229910052737 gold Inorganic materials 0.000 description 9
- 239000010931 gold Substances 0.000 description 9
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 229910052763 palladium Inorganic materials 0.000 description 3
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000010953 base metal Substances 0.000 description 2
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- GNLCAVBZUNZENF-UHFFFAOYSA-N platinum silver Chemical compound [Ag].[Ag].[Ag].[Pt] GNLCAVBZUNZENF-UHFFFAOYSA-N 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/45—Differential amplifiers
- H03F3/45071—Differential amplifiers with semiconductor devices only
- H03F3/45076—Differential amplifiers with semiconductor devices only characterised by the way of implementation of the active amplifying circuit in the differential amplifier
- H03F3/45475—Differential amplifiers with semiconductor devices only characterised by the way of implementation of the active amplifying circuit in the differential amplifier using IC blocks as the active amplifying circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
- H01H85/046—Fuses formed as printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
- H01L23/5256—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising fuses, i.e. connections having their state changed from conductive to non-conductive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/0293—Individual printed conductors which are adapted for modification, e.g. fusable or breakable conductors, printed switches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F2203/00—Indexing scheme relating to amplifiers with only discharge tubes or only semiconductor devices as amplifying elements covered by H03F3/00
- H03F2203/45—Indexing scheme relating to differential amplifiers
- H03F2203/45522—Indexing scheme relating to differential amplifiers the FBC comprising one or more potentiometers
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03G—CONTROL OF AMPLIFICATION
- H03G1/00—Details of arrangements for controlling amplification
- H03G1/0005—Circuits characterised by the type of controlling devices operated by a controlling current or voltage signal
- H03G1/0088—Circuits characterised by the type of controlling devices operated by a controlling current or voltage signal using discontinuously variable devices, e.g. switch-operated
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/24—Frequency- independent attenuators
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10181—Fuse
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Fuses (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/555,847 US4626818A (en) | 1983-11-28 | 1983-11-28 | Device for programmable thick film networks |
| US555847 | 1983-11-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60157247A JPS60157247A (ja) | 1985-08-17 |
| JPH0443423B2 true JPH0443423B2 (en]) | 1992-07-16 |
Family
ID=24218845
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59248828A Granted JPS60157247A (ja) | 1983-11-28 | 1984-11-27 | プログラム可能な厚膜回路網 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US4626818A (en]) |
| EP (1) | EP0143493B1 (en]) |
| JP (1) | JPS60157247A (en]) |
| DE (1) | DE3484731D1 (en]) |
Families Citing this family (54)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3539425A1 (de) * | 1985-11-07 | 1987-05-14 | Limitor Ag | Thermobimetallschalter |
| US5182538A (en) * | 1985-11-07 | 1993-01-26 | Limitor Ag | Bimetal thermoswitch |
| US4771260A (en) * | 1987-03-24 | 1988-09-13 | Cooper Industries, Inc. | Wire bonded microfuse and method of making |
| US4763228A (en) * | 1987-11-20 | 1988-08-09 | Union Carbide Corporation | Fuse assembly for solid electrolytic capacitor |
| US5204799A (en) * | 1990-03-22 | 1993-04-20 | Gpt Limited | Protective arrangement for telecommunications line interface circuit |
| US5097246A (en) * | 1990-04-16 | 1992-03-17 | Cooper Industries, Inc. | Low amperage microfuse |
| GB2255455A (en) * | 1991-04-22 | 1992-11-04 | Electronic Components Ltd | Fuse |
| IT1249299B (it) * | 1991-04-30 | 1995-02-22 | Sgs Thomson Microelectronics | Circuito integrato con componenti passivi trimmabili |
| US5097247A (en) * | 1991-06-03 | 1992-03-17 | North American Philips Corporation | Heat actuated fuse apparatus with solder link |
| DE4222278C1 (de) * | 1992-07-07 | 1994-03-31 | Roederstein Kondensatoren | Verfahren zur Herstellung elektrischer Dickschichtsicherungen |
| US5479147A (en) | 1993-11-04 | 1995-12-26 | Mepcopal Company | High voltage thick film fuse assembly |
| US5974661A (en) * | 1994-05-27 | 1999-11-02 | Littelfuse, Inc. | Method of manufacturing a surface-mountable device for protection against electrostatic damage to electronic components |
| US5790008A (en) * | 1994-05-27 | 1998-08-04 | Littlefuse, Inc. | Surface-mounted fuse device with conductive terminal pad layers and groove on side surfaces |
| US5552757A (en) * | 1994-05-27 | 1996-09-03 | Littelfuse, Inc. | Surface-mounted fuse device |
| US6191928B1 (en) | 1994-05-27 | 2001-02-20 | Littelfuse, Inc. | Surface-mountable device for protection against electrostatic damage to electronic components |
| US5929741A (en) * | 1994-11-30 | 1999-07-27 | Hitachi Chemical Company, Ltd. | Current protector |
| US5914648A (en) * | 1995-03-07 | 1999-06-22 | Caddock Electronics, Inc. | Fault current fusing resistor and method |
| JPH0992110A (ja) * | 1995-09-26 | 1997-04-04 | Denso Corp | 温度ヒューズ付抵抗器 |
| US5907272A (en) * | 1996-01-22 | 1999-05-25 | Littelfuse, Inc. | Surface mountable electrical device comprising a PTC element and a fusible link |
| US5652562A (en) * | 1996-05-21 | 1997-07-29 | Spectrol Electronics Corporation | Thermally fused resistor having a portion of a solder loop thermally connected to an electrically insulated portion of an outer surface of the resistor |
| US5977860A (en) * | 1996-06-07 | 1999-11-02 | Littelfuse, Inc. | Surface-mount fuse and the manufacture thereof |
| US5699032A (en) * | 1996-06-07 | 1997-12-16 | Littelfuse, Inc. | Surface-mount fuse having a substrate with surfaces and a metal strip attached to the substrate using layer of adhesive material |
| DE19704097A1 (de) * | 1997-02-04 | 1998-08-06 | Wickmann Werke Gmbh | Elektrisches Sicherungselement |
| US6373371B1 (en) * | 1997-08-29 | 2002-04-16 | Microelectronic Modules Corp. | Preformed thermal fuse |
| US5982268A (en) * | 1998-03-31 | 1999-11-09 | Uchihashi Estec Co., Ltd | Thin type fuses |
| JP4396787B2 (ja) * | 1998-06-11 | 2010-01-13 | 内橋エステック株式会社 | 薄型温度ヒュ−ズ及び薄型温度ヒュ−ズの製造方法 |
| US6034589A (en) * | 1998-12-17 | 2000-03-07 | Aem, Inc. | Multi-layer and multi-element monolithic surface mount fuse and method of making the same |
| US6456186B1 (en) * | 1999-10-27 | 2002-09-24 | Motorola, Inc. | Multi-terminal fuse device |
| US6791157B1 (en) * | 2000-01-18 | 2004-09-14 | Advanced Micro Devices, Inc. | Integrated circuit package incorporating programmable elements |
| DE10005836B4 (de) * | 2000-02-10 | 2006-10-12 | Vossloh-Schwabe Elektronik Gmbh | Leiterplattensicherung mit erhöhter Sicherheit |
| WO2001069988A1 (fr) * | 2000-03-14 | 2001-09-20 | Rohm Co., Ltd. | Carte a circuits imprimes comprenant un fusible |
| EP1396003A1 (de) * | 2001-06-11 | 2004-03-10 | Wickmann-Werke GmbH | Sicherungsbauelement |
| US7034652B2 (en) * | 2001-07-10 | 2006-04-25 | Littlefuse, Inc. | Electrostatic discharge multifunction resistor |
| CN1541437A (zh) * | 2001-07-10 | 2004-10-27 | 力特保险丝有限公司 | 网络设备用静电放电装置 |
| US6878004B2 (en) * | 2002-03-04 | 2005-04-12 | Littelfuse, Inc. | Multi-element fuse array |
| US7202770B2 (en) | 2002-04-08 | 2007-04-10 | Littelfuse, Inc. | Voltage variable material for direct application and devices employing same |
| US7183891B2 (en) | 2002-04-08 | 2007-02-27 | Littelfuse, Inc. | Direct application voltage variable material, devices employing same and methods of manufacturing such devices |
| US7132922B2 (en) | 2002-04-08 | 2006-11-07 | Littelfuse, Inc. | Direct application voltage variable material, components thereof and devices employing same |
| US6960978B2 (en) * | 2003-07-16 | 2005-11-01 | Hewlett-Packard Development Company, L.P. | Fuse structure |
| CN100408382C (zh) * | 2003-11-26 | 2008-08-06 | 力特保险丝有限公司 | 交通工具电气保护装置及利用该装置的系统 |
| DE102004033251B3 (de) * | 2004-07-08 | 2006-03-09 | Vishay Bccomponents Beyschlag Gmbh | Schmelzsicherung für einem Chip |
| US7477130B2 (en) * | 2005-01-28 | 2009-01-13 | Littelfuse, Inc. | Dual fuse link thin film fuse |
| US8289123B2 (en) * | 2005-07-22 | 2012-10-16 | Littelfuse, Inc. | Electrical device with integrally fused conductor |
| US7983024B2 (en) | 2007-04-24 | 2011-07-19 | Littelfuse, Inc. | Fuse card system for automotive circuit protection |
| US20090009281A1 (en) * | 2007-07-06 | 2009-01-08 | Cyntec Company | Fuse element and manufacturing method thereof |
| JP5287154B2 (ja) * | 2007-11-08 | 2013-09-11 | パナソニック株式会社 | 回路保護素子およびその製造方法 |
| US8525633B2 (en) * | 2008-04-21 | 2013-09-03 | Littelfuse, Inc. | Fusible substrate |
| WO2010048782A1 (zh) * | 2008-10-28 | 2010-05-06 | 南京萨特科技发展有限公司 | 片式保险丝及其制备方法 |
| US9129769B2 (en) * | 2009-09-04 | 2015-09-08 | Cyntec Co., Ltd. | Protective device |
| JP5571466B2 (ja) * | 2010-06-10 | 2014-08-13 | イビデン株式会社 | プリント配線板、電子デバイス、及びプリント配線板の製造方法 |
| ES2563170T3 (es) * | 2010-07-16 | 2016-03-11 | Schurter Ag | Elemento de fusible |
| CN104137217B (zh) * | 2012-02-20 | 2016-10-19 | 松尾电机株式会社 | 芯片型保险丝 |
| DE102019114228A1 (de) | 2019-05-28 | 2020-12-03 | Ebm-Papst Mulfingen Gmbh & Co. Kg | Analogspannungsprogrammierung |
| US20230422391A1 (en) * | 2020-12-25 | 2023-12-28 | Hitachi Astemo, Ltd. | Vehicle-mounted electronic control device |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE631489A (en]) * | 1962-04-27 | |||
| GB1001908A (en) * | 1962-08-31 | 1965-08-18 | Texas Instruments Inc | Semiconductor devices |
| US3401452A (en) * | 1966-04-28 | 1968-09-17 | Electra Midland Corp | Method of making a precision electric fuse |
| GB1184056A (en) * | 1966-05-20 | 1970-03-11 | Johnson Matthey Co Ltd | Improved Fuse |
| US3564354A (en) * | 1968-12-11 | 1971-02-16 | Signetics Corp | Semiconductor structure with fusible link and method |
| US4445274A (en) * | 1977-12-23 | 1984-05-01 | Ngk Insulators, Ltd. | Method of manufacturing a ceramic structural body |
| US4201970A (en) * | 1978-08-07 | 1980-05-06 | Rca Corporation | Method and apparatus for trimming resistors |
-
1983
- 1983-11-28 US US06/555,847 patent/US4626818A/en not_active Expired - Fee Related
-
1984
- 1984-11-20 EP EP84201675A patent/EP0143493B1/en not_active Expired
- 1984-11-20 DE DE8484201675T patent/DE3484731D1/de not_active Expired - Lifetime
- 1984-11-27 JP JP59248828A patent/JPS60157247A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| EP0143493B1 (en) | 1991-06-19 |
| JPS60157247A (ja) | 1985-08-17 |
| EP0143493A3 (en) | 1987-03-04 |
| DE3484731D1 (de) | 1991-07-25 |
| US4626818A (en) | 1986-12-02 |
| EP0143493A2 (en) | 1985-06-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0443423B2 (en]) | ||
| US6269745B1 (en) | Electrical fuse | |
| US6384708B1 (en) | Electrical fuse element | |
| US3978443A (en) | Fusible resistor | |
| TWI500063B (zh) | 包含電阻及熔線元件之電路保護裝置 | |
| US5148141A (en) | Fuse with thin film fusible element supported on a substrate | |
| US4301439A (en) | Film type resistor and method of producing same | |
| JPH09246001A (ja) | 抵抗組成物およびこれを用いた抵抗器 | |
| US4582659A (en) | Method for manufacturing a fusible device for use in a programmable thick film network | |
| US3316467A (en) | Spark gap electronic component | |
| US6859999B2 (en) | Method for manufacturing a power chip resistor | |
| JP3074527B2 (ja) | チップ形ヒューズ抵抗器 | |
| JP2003249403A (ja) | チップ抵抗器 | |
| JP2670756B2 (ja) | チップ形ヒューズ抵抗器、及びその製造方法 | |
| JP2002270408A (ja) | チップ型ヒューズ抵抗器及びその製造方法 | |
| JPS63170826A (ja) | 回路遮断素子 | |
| JPH04365304A (ja) | ヒューズ付チップ抵抗器 | |
| JPH05267815A (ja) | セラミックス配線基板及びその製造方法 | |
| JP2867711B2 (ja) | 機能修正用角形チップ抵抗器およびその製造方法およびそのトリミング方法 | |
| JPH10335119A (ja) | ヒューズ抵抗器とそれを用いた電子機器 | |
| KR100854118B1 (ko) | 퓨즈 저항기 및 그 제조 방법 | |
| JPH0121606B2 (en]) | ||
| JP2007082302A (ja) | 回路保護部品 | |
| JP2001093643A (ja) | 表面実装型サージ吸収素子及びその製造方法 | |
| JP2000173805A (ja) | ヒューズ付き抵抗器とその製造方法 |